JOINING OF ALUMINA CERAMICS TO COPPER

SHAO Guang-jie, QIN Xiu-juan, JING Qin, et al. JOINING OF ALUMINA CERAMICS TO COPPER[J]. Acta Materiae Compositae Sinica, 2001, 18(4): 133-135.

Citation:

SHAO Guang-jie, QIN Xiu-juan, JING Qin, et al. JOINING OF ALUMINA CERAMICS TO COPPER[J]. Acta Materiae Compositae Sinica, 2001, 18(4): 133-135.

Citation:

SHAO Guang-jie, QIN Xiu-juan, JING Qin, et al. JOINING OF ALUMINA CERAMICS TO COPPER[J]. Acta Materiae Compositae Sinica, 2001, 18(4): 133-135.

Abstract

Joining of alumina ceramics to copper was investigated with a self-made producing device. Studies were focused on temperatures, pressures and interfacial cohesive strength. The highest joining strenth of 15.1 MPa was obtained for the sample under the conditions of 725 ℃ for joining temperature, 7.5 MPa for joining pressure and 300 s for joining time.

FullText(HTML)

Export File