WANG Xiansheng, XIAO Yangguo, CHEN Haisheng. Properties of cured compound of amine-terminated dendrimer PAMAM/epoxy resin system[J]. Acta Materiae Compositae Sinica, 2007, 24(5): 38-43.
Citation: WANG Xiansheng, XIAO Yangguo, CHEN Haisheng. Properties of cured compound of amine-terminated dendrimer PAMAM/epoxy resin system[J]. Acta Materiae Compositae Sinica, 2007, 24(5): 38-43.

Properties of cured compound of amine-terminated dendrimer PAMAM/epoxy resin system

  • Amine-terminated dendrimer PAMAM was used as an agent in the epoxy resin system, and the influence of the ratio and curing temperature on the properties of cured compounds of PAMAM and epoxy resin was studied by tensile test, impact test, DSC and TGA. The results show that the optimum curing temperature is 140℃, and the influence of the ratio of PAMAM to epoxy resin is different as the curing temperature changes: the optimum ratio is 0.47 (mass ratio of PAMAM to epoxy resin) cured at 80℃, where the optimum mechanical property, the highest glass translation temperature and crosslink density can be obtained. The optimum ratio shifts to a lower ratio as the curing temperature increases: the optimum ratio is 0.28 cured at 140℃, where the optimum mechanical property, the highest glass translation temperature and crosslink density can be obtained. However, the density of the cured compounds and the volume shrinkage reach the maximum when the ratio is 0.47, and the thermal stability is the best when the ratio is 0.28. The cure degree was determined by titration, the result showing that the cure degree of the lower ratio system rapidly soars and approaches the cure degree of the stoichiometric point system as the curing temperature increases.
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