ZHU Jian-hua, LIU Lei, ZHAO Hai-jun, et al. Microstructure and property of electroformed nano-Al2O3 / Cu composite[J]. Acta Materiae Compositae Sinica, 2006, 23(4): 65-71.
Citation: ZHU Jian-hua, LIU Lei, ZHAO Hai-jun, et al. Microstructure and property of electroformed nano-Al2O3 / Cu composite[J]. Acta Materiae Compositae Sinica, 2006, 23(4): 65-71.

Microstructure and property of electroformed nano-Al2O3 / Cu composite

  • The composite elect roforming technology was employed to fabricate nano-sized alumina particles (nano-Al2O3 ) reinforced copper composite in copper sulfate sulfuric acid plating solution. The surface , f racture and wearsurface morphologies were observed by scanning elect ron microscopy (SEM) , and the microst ructure was observedby t ransmission elect ron microscopy ( TEM) . Microhardness , tensile property , wear resistance and elect rical resistivity ( Er ) were examined. The result s show that Al2O3 particles and their agglomerations with nano size disperse inthe copper mat rix and have good bonding with copper mat rix. The microhardness of composite can be 42 % higherthan that of elect roformed pure copper. The tensile st rength and the extensibility reach 385 MPa and 26 % , respectively , as the nano-Al2O3 mass f raction is 1. 26 %. Wear resistance of composite is enhanced obviously. Comparedwith elect roformed pure copper , the increase amplitude in elect rical resistivity of the composite is below 6 %.
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