Preparation and properties of SiC_P-SiC_W hybrid fillers/bismaleimide thermal conductivity composites

Functionalized SiC particle-SiC whisker (SiC_P-SiC_W) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiC_P-SiC_W/bismaleimide (SiC_P-SiC_W/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiC_P-SiC_W/BMI thermal conductivity composites were investigated.The results show that the functionalized SiC_P-SiC_W/BMI thermal conductivity composite with 40wt% functionalized SiC_P-SiC_W(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient λ of 1.125 W (m·K)^-1,dielectric constant ε of 4.12,and 5wt% thermal mass loss temperature of 427℃.